Edited by: Bharat Upadhyay
Last updated: February 16, 2023, 9:26 AM IST
MediaTek Dimensity 7200 chipset launched. (Image source: gizmochina)
The Dimensity 7200 processor delivers the same second-generation TSMC 4nm process found in the Dimensity 9200.
MediaTek announced on Thursday the launch of its new mid-range Dimensity 7200 processor, in the new Dimensity 7000 series. MediaTek’s new chipset has advanced AI imaging features, powerful gaming optimizations and impressive 5G speed, the company said.
According to the brand, the Dimensity 7200 processor delivers the same second-generation TSMC 4nm process found in the Dimensity 9200, and is ideal for ultra-thin designs in a variety of form factors.
The octa-core CPU integrates two Arm Cortex-A715 cores, with operating speeds of up to 2.8 GHz, with six Cortex-A510 cores, allowing users to multitask effortlessly and enjoy peak performance in any app. To further optimize power and performance, MediaTek’s built-in AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI fusion processing.
“The MediaTek Dimensity 7000 Series will be vital for mobile gamers and photography enthusiasts looking for an affordable way to get the most battery life out of their phones without sacrificing performance,” said CH Chen, deputy general manager of MediaTek’s Wireless Communications Business Unit.
For gamers, MediaTek HyperEngine 5.0 technology delivers AI-based Variable Rate Shading (VRS) for power saving, CPU and GPU optimization of smart resources for longer battery life, and other upgrades for smooth gameplay. The chipset also integrates a powerful Arm Mali G610 GPU that supports fast response times and supports high frame rates.
Using MediaTek’s Imagiq 765 and a 14-bit HDR ISP, the Dimensity 7200 supports 200 MP main cameras for epic photography. The chipset enables impressive video recording with 4K HDR video and even allows users to simultaneously capture content from two cameras in Full HD resolution, while keeping everything sharp with all-pixel autofocus technology.
In addition, the chipset has built-in motion-compensated noise reduction. In addition, the APU supports powerful AI camera enhancements such as real-time portrait beautification.
Dimensity 720 supports triband Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. It supports 2CC Carrier Aggregation and Dual 5G SIM with dual VoNR. The Dual SIM capability also allows users to have two connections, making it easy to take business and personal calls from a single smartphone, the company said.
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